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Validate LIS3DH motion data using range and mode settings, correct output scaling, mounting orientation and FIFO timing before interpreting acceleration.

Tune MPR121 touch sensing using filtered electrode data, baseline tracking, hysteresis and final-enclosure tests instead of copying one universal threshold.

Set up MCP9600 thermocouple measurements with the correct probe type, connector polarity, cold-junction placement and explicit error handling.

Use INA3221 channels with verified external shunts, correct sign decoding and scan timing while distinguishing bus voltage, current and calculated power.

Plan INA260 measurements with current-path inspection, connector limits, conversion timing and low-voltage validation instead of assuming every board handles the IC rating.

Read MAX44009 lux data with correct exponent decoding, integration settings and optical placement while distinguishing low power from fast measurement.

Use AS7341 spectral measurements responsibly by checking carrier voltage, SMUX mapping, exposure, illumination and calibration before comparing color samples.

Bring up an MCP3002 ADC with a known input, correct SPI framing, supply-referenced scaling and a source impedance check before sampling two channels.

Evaluate ADS1256 ADC modules using reference quality, input limits, channel settling and noise tests rather than assuming 24-bit codes mean 24-bit accuracy.

Plan an MCP4728 DAC project with reference selection, output loading, synchronized updates and safe EEPROM use before connecting four analog channels.